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1.
A diimide dicarboxylic acid, 1,4‐bis(4‐trimellitimidophenoxy)naphthalene (1,4‐BTMPN), was prepared by condensation of 1,4‐bis(4‐aminophenoxy)naphthalene and trimellitic anhydride at a 1 : 2 molar ratio. A series of novel poly(amide‐imide)s (IIa–k) with inherent viscosities of 0.72 to 1.59 dL/g were prepared by triphenyl phosphite‐activated polycondensation from the diimide‐diacid 1,4‐BTMPN with various aromatic diamines (Ia–k) in a medium consisting of N‐methyl‐2‐pyrrolidinone (NMP), pyridine, and calcium chloride. The poly(amide‐imide)s showed good solubility in NMP, N,N‐dimethylacetamide, and N,N‐dimethylformamide. The thermal properties of the obtained poly(amide‐imide)s were examined with differential scanning calorimetry and thermogravimetry analysis. The synthesized poly(amide‐imide)s possessed glass‐transition temperatures in the range of 215 to 263°C. The poly(amide‐imide)s exhibited excellent thermal stabilities and had 10% weight losses at temperatures in the range of 538 to 569°C under a nitrogen atmosphere. A comparative study of some corresponding poly(amide‐imide)s also is presented. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1–8, 2000  相似文献   

2.
A new bulky pendent bis(ether anhydride), 1,1‐bis[4‐(4‐dicarboxyphenoxy)phenyl]‐4‐phenylcyclohexane dianhydride, was prepared in three steps, starting from the nitrodisplacement of 1,1‐bis(4‐hydroxyphenyl)‐4‐phenylcyclohexane with 4‐nitrophthalonitrile to form bis(ether dinitrile), followed by alkaline hydrolysis of the bis(ether dinitrile) and subsequent dehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s were prepared from the bis(ether anhydride) with various diamines by a conventional two‐stage synthesis including polyaddition and subsequent chemical cyclodehydration. The resulting poly(ether imide)s had inherent viscosities of 0.50–0.73 dL g?1. The gel permeation chromatography measurements revealed that the polymers had number‐average and weight‐average molecular weights of up to 57,000 and 130,000, respectively. All the polymers showed typical amorphous diffraction patterns. All of the poly(ether imide)s showed excellent solubility in comparison with the other polyimides derived from adamantane, norbornane, cyclododecane, and methanohexahydroindane and were readily dissolved in various solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide (DMAc), N,N‐dimethylformamide, pyridine, cyclohexanone, tetrahydrofuran, and even chloroform. These polymers had glass‐transition temperatures of 226–255 °C. Most of the polymers could be dissolved in chloroform in as high as a 30 wt % concentration. Thermogravimetric analysis showed that all polymers were stable up to 450 °C, with 10% weight losses recorded from 458 to 497 °C in nitrogen. These transparent, tough, and flexible polymer films could be obtained by solution casting from DMAc solutions. These polymer films had tensile strengths of 79–103 MPa and tensile moduli of 1.5–2.1 GPa. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2066–2074, 2002  相似文献   

3.
A series of new soluble poly(amide‐imide)s were prepared from the diimide‐dicarboxylic acid 2,2‐bis[4‐(4‐trimellitimidophenoxy)phenyl]hexafluoropropane with various diamines by direct polycondensation in N‐methyl‐2‐pyrrolidinone containing CaCl2 with triphenyl phosphite and pyridine as condensing agents. All the polymers were obtained in quantitative yields with inherent viscosities of 0.52–0.86 dL · g?1. The poly(amide‐imide)s showed an amorphous nature and were readily soluble in various solvents, such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide (DMAc), N,N‐dimethylformamide, pyridine, and cyclohexanone. Tough and flexible films were obtained through casting from DMAc solutions. These polymer films had tensile strengths of 71–107 MPa and a tensile modulus range of 1.6–2.7 GPa. The glass‐transition temperatures of the polymers were determined by a differential scanning calorimetry method, and they ranged from 242 to 279 °C. These polymers were fairly stable up to a temperature around or above 400 °C, and they lost 10% of their weight from 480 to 536 °C and 486 to 537 °C in nitrogen and air, respectively. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 3498–3504, 2001  相似文献   

4.
A series of new strictly alternating aromatic poly(ester‐imide)s having inherent viscosities of 0.20–0.98 dL/g was synthesized by the diphenylchlorophosphate (DPCP) activated direct polycondensation of the preformed imide ring‐containing diacid, 3,3‐bis[4‐(trimellitimidophenoxy)phenyl]phthalide (I), with various bisphenols in a medium consisting of pyridine and lithium chloride. The diimide–diacid I was prepared from the condensation of 3,3‐bis[4‐(4‐aminophenoxy)phenyl]phthalide and trimellitic anhydride. Most of the resulting polymers showed an amorphous nature and were readily soluble in a variety of organic solvents such as N‐methyl‐2‐pyrrolidone (NMP) and N,N‐dimethylacetamide (DMAc). Transparent and flexible films of these polymers could be cast from their DMAc solutions. The cast films had tensile strengths ranging 66–105 MPa, elongations at break from 7–10%, and initial moduli from 1.9–2.4 GPa. The glass‐transition temperatures of these polymers were recorded between 208–275 °C. All polymers showed no significant weight loss below 400 °C in the air or in nitrogen, and the decomposition temperatures at 10% weight loss all occurred above 460 °C. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1090–1099, 2000  相似文献   

5.
Three new bis(ether‐acyl chloride) monomers, 1,1‐bis[4‐(4‐chloroformylphenoxy)phenyl]cyclohexane ( 1a ), 5,5‐bis[4‐(4‐chloroformylphenoxy)phenyl]‐4,7‐methanohexahydroindan ( 1b ), and 9,9‐bis[4‐(4‐chloroformylphenoxy)phenyl]fluorene ( 1c ), were synthesized from readily available compounds. Aromatic polybenzoxazoles bearing ether and cardo groups were obtained by the low‐temperature solution polycondensation of the bis(ether‐acyl chloride)s with three bis(aminophenol)s and the subsequent thermal cyclodehydration of the resultant poly(o‐hydroxy amide)s. The intermediate poly(o‐hydroxy amide)s exhibited inherent viscosities in the range of 0.35–0.71 dL/g. All of the poly(o‐hydroxy amide)s were amorphous and soluble in many organic polar solvents, and most of them could afford flexible and tough films by solvent casting. The poly(o‐hydroxy amide)s exhibited glass‐transition temperatures (Tg's) in the range of 141–169 °C and could be thermally converted into the corresponding polybenzoxazoles approximately in the region of 240–350 °C, as indicated by the DSC thermograms. Flexible and tough films of polybenzoxazoles could be obtained by thermal cyclodehydration of the poly(o‐hydroxy amide) films. All the polybenzoxazoles were amorphous and showed an enhanced Tg but a dramatically decreased solubility as compared with their poly(o‐hydroxy amide) precursors. They exhibited Tg's of 215–272 °C by DSC and showed insignificant weight loss before 500 °C in nitrogen or air. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 4014–4021, 2001  相似文献   

6.
A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10?3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003  相似文献   

7.
A series of poly(amide–imide)s IIIa–m containing flexible isopropylidene and ether groups in the backbone were synthesized by the direct polycondensation of 4,4′‐[1,4‐phenylenebis(isopropylidene‐1,4‐phenyleneoxy)]dianiline (PIDA) with various bis(trimellitimide)s IIa–m in N‐methyl‐2‐pyrrolidone (NMP) using triphenyl phosphite and pyridine as condensing agents. The resulting poly(amide–imide)s had inherent viscosities in the range of 0.80–1.36 dL/g. Except for those from the bis(trimellitimide)s of p‐phenylenediamine and benzidine, all the polymers could be cast from DMAc into transparent and tough films. They exhibited excellent solubility in polar solvents. The 10% weight loss temperatures of the polymers in air and in nitrogen were all above 495°C, and their Tg values were in the range of 201–252°C. Some properties of poly(amide–imide)s III were compared with those of the corresponding poly(amide–imide)s V prepared from the bis(trimellitimide) of diamine PIDA and various aromatic diamines. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 69–76, 1999  相似文献   

8.
Two new bis(ether acyl chloride)s, 1,1‐bis[4‐(4‐chloroformylphenoxy)phenyl]‐1‐phenylethane and 1,1‐bis[4‐(4‐chloroformylphenoxy)phenyl]‐1‐phenyl‐2,2,2‐trifluoroethane, were prepared from readily available reagents. Aromatic polybenzoxazoles with both ether and phenylethylidene or 1‐phenyl‐2,2,2‐trifluoroethylidene linkages between phenylene units were obtained by a conventional two‐step procedure including the low‐temperature solution polycondensation of the bis(ether acyl chloride)s with three bis(o‐aminophenol)s, yielding poly(o‐hydroxyamide) precursors, and subsequent thermal cyclodehydration. The intermediate poly(o‐hydroxyamide)s exhibited inherent viscosities of 0.39–0.98 dL/g. All of the poly(o‐hydroxyamide)s were amorphous and soluble in polar organic solvents such as N,N‐dimethylacetamide, and most of them could afford flexible and tough films via solvent casting. The poly(o‐hydroxyamide)s exhibited glass‐transition temperatures (Tg's) of 129–194 °C and could be thermally converted into corresponding polybenzoxazoles in the solid state at temperatures higher than 300 °C. All the polybenzoxazoles were amorphous and showed an enhanced Tg but a dramatically decreased solubility with to respect to their poly(o‐hydroxyamide) precursors. They exhibited Tg's of 216–236 °C through differential scanning calorimetry and were stable up to 500 °C in nitrogen or air, with 10% weight‐loss temperatures being recorded between 538 and 562 °C in nitrogen or air. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 914–921, 2003  相似文献   

9.
A bis(ether anhydride) monomer, 1,1‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]cyclohexane dianhydride ( IV‐A ), was synthesized from the nitro displacement of 4‐nitrophthalodinitrile by the phenoxide ion of 1,1‐bis(4‐hydroxyphenyl)cyclohexane ( I‐A ), followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and dehydration of the resulting bis(ether acid). A novel series of organosoluble poly(ether imide)s ( VI a–i )(PEIs) bearing cyclohexylidene cardo groups was prepared from the bis(ether anhydride) IV‐A with various aromatic diamines V a–i via a conventional two‐stage process. The PEIs had inherent viscosities in the range of 0.48–1.02 dL/g and afforded flexible and tough films by solution‐casting because of their good solubilities in organic solvents. Most PEIs showed yield points in the range of 89–102 MPa at stress‐strain curves and had tensile strengths of 78–103 MPa, elongations at breaks of 8–62%, and initial moduli of 1.8–2.2 GPa. The glass‐transition temperatures (Tg's) of these PEIs were recorded between 200–234 °C. Decomposition temperatures of 10% weight loss all occurred above 490 °C in both air and nitrogen atmospheres, and their residues were more than 43% at 800 °C in nitrogen atmosphere. The cyclohexane cardo‐based PEIs exhibited relatively higher Tg's, better solubilities in organic solvents, and better tensile properties as compared with the corresponding Ultem® PEI system. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 788–799, 2001  相似文献   

10.
A CF3‐containing diamine, 1,4‐bis(4‐amino‐2‐trifluromethylphenoxy) benzene ( I ), was prepared from hydroquinone and 2‐chloro‐5‐nitrobenzotrifluoride. Imide‐containing diacids ( V a–h and VI a,b ) were prepared through the condensation reaction of amino acids, aromatic diamines, and trimellitic anhydride. Then, a series of soluble fluorinated polyamides ( VII a–h ) and poly(amide imide)s ( VIII a–h and X a,b ) were synthesized from I with various aromatic diacids ( II a–h ) and imide‐containing diacids ( V a–h and VI a,b ) via direct polycondensation with triphenyl phosphate and pyridine. The polyamides and poly(amide imide)s had inherent viscosities of 1.00–1.70 and 0.79–1.34 dL/g, respectively. All the synthesized polymers showed excellent solubility in amide‐type solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide, and N‐dimethylformamide and afforded transparent and tough films via solvent casting. Polymer films of VII a–h , VIII a–h , and X a,b had tensile strengths of 91–113 MPa, elongations to break of 8–40%, and initial moduli of 2.1–2.8 GPa. The glass‐transition temperatures of the polyamides and poly(amide imide)s were 254–276 and 255–292 °C, respectively, and the imide‐containing poly(amide imide)s had better thermal stability than the polyamides. The polyamides showed higher transparency and were much lighter in color than the poly(amide imide)s, and their cutoff wave numbers were below 400 nm. In comparison with isomeric IX c – h , poly(amide imide)s VIII c–h exhibited less coloring and showed lower yellowness indices. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3116–3129, 2004  相似文献   

11.
A new type of tetraimide‐dicarboxylic acid ( I ) was synthesized starting from the ring‐opening addition of m‐aminobenzoic acid, 4,4′‐oxydiphthalic anhydride, and 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane at a 2:2:1 molar ratio in N‐methyl‐2‐pyrrolidone (NMP), followed by cyclodehydration to the diacid I . A series of soluble and light‐colored poly(amide‐imide‐imide)s ( III a–j) was prepared by triphenyl phosphite‐activated polycondensation from I with various aromatic diamines ( II a–j). All films cast from N,N‐dimethylacetamide (DMAc) had cutoff wavelengths shorter than 390 nm (374–390 nm) and b* values between 25.26 and 43.61; these polymers were much lighter in color than the alternating trimellitimide series. All of the polymers were readily soluble in a variety of organic solvents such as NMP, DMAc, N,N‐dimethylformamide, dimethyl sulfoxide, and even in less polar m‐cresol and pyridine. Polymers III a–j afforded tough, transparent, and flexible films that had tensile strengths ranging from 96 to 118 MPa, elongations at break from 9 to 11%, and initial moduli from 2.0 to 2.5 GPa. The glass‐transition temperatures of the polymers were recorded at 240–268 °C. They had 10% weight loss at a temperature above 540 °C and left more than 55% residue even at 800 °C in nitrogen. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 707–718, 2002; DOI 10.1002/pola.10153  相似文献   

12.
A new adamantane‐based bis(ether anhydride), 2,2‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]adamantane dianhydride, was prepared in three steps starting from nitrodisplacement of 4‐nitrophthalonitrile with the potassium phenolate of 2,2‐bis(4‐hydroxyphenyl)adamantane. A series of adamantane‐containing poly(ether imide)s were prepared from the adamantane‐based bis(ether anhydride) and aromatic diamines by a conventional two‐stage synthesis in which the poly(ether amic acid)s obtained in the first stage were heated stage‐by‐stage at 150–270°C to give the poly(ether imide)s. The intermediate poly(ether amic acid)s had inherent viscosities between 0.56 and 1.92 dL/g. Except for those from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all the poly(ether amic acid) films could be thermally converted into transparent, flexible, and tough poly(ether imide) films. All the poly(ether imide)s showed limited solubility in organic solvents, although they were amorphous in nature as evidenced by X‐ray diffractograms. Glass transition temperatures of these poly(ether imide)s were recorded in the range of 242–317°C by differential scanning calorimetry and of 270–322°C by dynamic mechanical analysis. They exhibited high resistance to thermal degrdation, with 10% weight loss temperatures being recorded between 514–538°C in nitrogen and 511–527°C in air. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1619–1628, 1999  相似文献   

13.
A novel bis(ether anhydride) monomer, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride (4), was synthesized from the nitrodisplacement of 4‐nitrophthalonitrile by the bisphenoxide ion of 9,9‐bis(4‐hydroxyphenyl)fluorene (1), followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetracarboxylic acid. A series of poly(ether imide)s bearing the fluorenylidene group were prepared from the bis(ether anhydride) 4 with various aromatic diamines 5a–i via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s 6a–i followed by thermal cyclodehydration to the polyimides 7a–i. The intermediate poly(amic acid)s had inherent viscosities in the range of 0.39–1.57 dL/g and afforded flexible and tough films by solution‐casting. Except for those derived from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all other poly(amic acid) films could be thermally transformed into flexible and tough polyimide films. The glass transition temperatures (Tg) of these poly(ether imide)s were recorded between 238–306°C with the help of differential scanning calorimetry (DSC), and the softening temperatures (Ts) determined by thermomechanical analysis (TMA) stayed in the range of 231–301°C. Decomposition temperatures for 10% weight loss all occurred above 540°C in an air or a nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1403–1412, 1999  相似文献   

14.
1,1‐Bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane (BAPPE) was prepared through nucleophilic substitution reaction of 1,1‐bis(4‐hydroxyphenyl)‐1‐phenylethane and p‐chloronitrobenzene in the presence of K2CO3 in N,N‐dimethylformamide, followed by catalytic reduction with hydrazine and Pd/C. Novel organosoluble polyimides and copolyimides were synthesized from BAPPE and six kinds of commercial dianhydrides, including pyromellitic dianhydride (PMDA, Ia ), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA, Ib ), 3,3′,4,4′‐ biphenyltetracarboxylic dianhydride (BPDA, Ic ), 4,4′‐oxydiphthalic anhydride (ODPA, Id ), 3,3′,4,4′‐diphenylsulfonetetracarboxylic dianhydride (DSDA, Ie ) and 4,4′‐hexafluoroisopropylidenediphthalic anhydride (6FDA, If ). Differing with the conventional polyimide process by thermal cyclodehydration of poly(amic acid), when polyimides were prepared by chemical cyclodehydration with N‐methyl‐2‐pyrrolidone as used solvent, resulted polymers showed good solubility. Additional, Ia,b were mixed respectively with the rest of dianhydrides (Ic–f) and BAPPE at certain molar ratios to prepare copolyimides with arbitrary solubilities. These polyimides and copolyimides were characterized by good mechanical properties together with good thermal stability. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2082–2090, 2000  相似文献   

15.
A novel series of colorless and highly organosoluble poly(ether imide)s were prepared from 3,3‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]phthalide dianhydride with various fluorinated aromatic bis(ether amine)s via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by cyclodehydration to produce the polymer films. The poly(ether imide)s showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents, in ether‐type solvents, and even in chlorinated solvents. Their films had a cutoff wavelength between 358 and 373 nm, and the yellowness index ranged from 3.1 to 9.5. The glass‐transition temperatures of the poly(ether imide) series were recorded between 237 and 297 °C, the decomposition temperatures at 10% weight loss were all above 494 °C, and the residue was more than 54% at 800 °C in nitrogen. These films showed high tensile strength and also were characterized by higher solubility, lighter color, and lower dielectric constants and moisture absorption than an analogous nonfluorinated polyimide series. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3140–3152, 2006  相似文献   

16.
A new one‐pot procedure for imide–acid monomer synthesis and polymerization is reported for four new poly(amide–imide)s. Bisphenol A dianhydride (BPADA) was reacted with twice the molar amount of 3‐aminobenzoic acid (3ABA) or 3‐amino‐4‐methylbenzoic acid (3A4MBA) in 1‐methyl‐2‐pyrrolidinone (NMP) and toluene mixture, and the amic acid intermediates cyclized in solution to give two diimide‐containing dicarboxylic acid monomers. Without isolation, the diacid monomers were then polymerized with either 1,3‐diaminomesitylene (DAM) or 1,5‐diaminonaphthalene (1,5NAPda) using triphenyl phosphite‐activation to give a series of four soluble poly(amide–imide)s, PAI. Isolation and purification of the dicarboxylic acid monomers was not necessary for formation of high molecular weight polymers as indicated by intrinsic viscosities of 0.64–1.04 dL/g determined in N,N‐dimethylacetamide (DMAc). All of the PAI were soluble in polar aprotic solvents such as NMP, DMAc, and dimethyl sulfoxide (DMSO). Glass transition temperatures ranged from 243 to 279°C by DSC, and 5% weight loss temperatures were above 400°C in both air and nitrogen. Flexible films cast from DMAc were light yellow, transparent, and tough. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1183–1188, 1999  相似文献   

17.
A novel bis(ether anhydride) monomer, 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide ion of 2′,5′‐dihydroxy‐p‐terphenyl, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and cyclodehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s bearing laterally attached p‐terphenyl groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal or chemical imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were in the range of 0.62–1.26 dL/g. Most of the poly(ether imide)s obtained from both routes were soluble in polar organic solvents, such as N,N‐dimethylacetamide. All the poly(ether imide)s could afford transparent, flexible, and strong films with high tensile strengths. The glass‐transition temperatures of these poly(ether imide)s were recorded as between 214 and 276 °C by DSC. The softening temperatures of all the poly(ether imide) films stayed in the 207–265 °C range according to thermomechanical analysis. For all the polymers significant decomposition did not occur below 500 °C in nitrogen or air atmosphere. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1008–1017, 2004  相似文献   

18.
A series of poly(amide‐imide)s were prepared using a new monomer, 1,3‐bis(trimellitimido)‐2,4,6‐trimethyl benzene (BTB), with four different diamines: 1,4‐phenylene diamine (PDA), 2,4‐diamino mesitylene (DAM), 2,2′‐dimethyl‐4,4′‐diamino biphenyl (DMDB), and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFDB). They were prepared by the condensation method in N‐methyl‐2‐pyrrolidinone (NMP) solvent using triphenyl phosphate and pyridine as condensing agents. The synthesized poly(amide‐imide)s were characterized by Fourier transform infrared and 1H NMR techniques. Films were prepared and characterized using DSC, thermogravimetric analysis (TGA), a prism coupler, and a film dielectric property analyzer. DSC measurement showed that the glass‐transition temperatures of the polymers were in the range of 259–327 °C. TGA analysis showed 5% weight loss, in the range of 472–514 °C. The refractive index varied from 1.6004 to 1.6586 in the following increasing order: BTB‐TFBM < BTB‐DAM < BTB‐DMDB < BTB‐PDA. For the poly(amide‐imide) films, the birefringence varied in the range of 0.0319–0.0580, in the following increasing order: BTB‐DAM < BTB‐TFBM < BTB‐DMDB < BTB‐PDA. The capacitance method showed that the dielectric constant of poly(amide‐imide) varied with the diamine structure; no difference was found by the optical method. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 137–143, 2004  相似文献   

19.
3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (4,4′‐carbonyldiphathalic anhydride) was reacted with L ‐leucine in a mixture of acetic acid and pyridine (3 : 2), and the resulting imide‐acid [N,N′‐(4,4′‐carbonyldiphthaloyl)‐bis‐L ‐leucine diacid] was obtained in quantitative yield. The compound was converted to the N,N′‐(4,4′‐carbonyldiphthaloyl)‐bis‐L ‐leucine diacid chloride by reaction with thionyl chloride. A new facile and rapid polycondensation reaction of this diacid chloride with several aromatic diamines such as 4,4′‐diaminodiphenyl methane, 2,4‐diaminotoluene, 4,4′‐sulfonyldianiline, p‐phenylenedi‐amine, 4,4′‐diaminodiphenylether, and m‐phenylenediamine was developed by using a domestic microwave oven in the presence of a small amount of a polar organic medium such as O‐cresol. The polymerization reactions proceeded rapidly compared with the conventional solution polycondensation and were completed within 6 min, producing a series of optically active poly(amide‐imide)s with a high yield and an inherent viscosity of 0.37–0.57 dL/g. All of the above polymers were fully characterized by IR, elemental analyses, and specific rotation. Some structural characterization and physical properties of these optically active poly(amide‐imide)s are reported. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 177–186, 2001  相似文献   

20.
Thermoplastic and organic‐soluble aromatic polyamides containing both bulky triphenylethane units and flexible ether linkages were prepared directly from 1,1‐bis[4‐(4‐carboxyphenoxy)phenyl]‐1‐phenylethane ( III ) with various aromatic diamines or from 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane ( V ) with various aromatic dicarboxylic diacids via triphenyl phosphite and pyridine. These polyamides had inherent viscosities ranging from 0.71 to 1.77 dL/g. All the polymers easily were dissolved in aprotic polar solvents such as N‐methyl‐2‐pyrrolidone and N,N‐dimethylacetamide, and some even could be dissolved in less polar solvents such as tetrahydrofuran. The flexible and tough films cast from the polymer solutions possessed tensile strengths of 89 to 104 MPa. The polyamides were thermally stable up to 460°C in air or nitrogen. Glass‐transition temperatures of these polyamides were observed in a range of 179 to 268°C via differential scanning calorimetry or thermomechanical analysis. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 247–260, 2000  相似文献   

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