| 金刚石微粉低温化学镀镍品质影响因素 |
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| 引用本文： | 方莉俐,李靖华,刘韩.金刚石微粉低温化学镀镍品质影响因素[J].人工晶体学报,2022,51(8):1459-1465. |
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| 作者姓名： | 方莉俐 李靖华 刘韩 |
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| 作者单位： | 中原工学院理学院,郑州市低维量子材料及器件重点实验室,郑州 450007 |
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| 基金项目： | 2021年河南省重点研发与推广专项(212102210488) |
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| 摘 要： | 研究络合剂、镀液pH值、温度对金刚石微粉低温化学镀镍品质的影响。在温度为35 ℃、pH值为5时,通过改变络合剂配比,对镀液稳定性,镀层沉积速率、形貌和磷(P)含量进行测试分析。结果表明,20 g/L的柠檬酸+5 g/L的琥珀酸为本文最优的络合剂配比,其化学镀液稳定性好、沉积速率较快(0.391 5 g/h),镀层致密无漏镀,P含量为11.73%(质量分数)。用最优络合剂,通过改变镀液pH值、温度,对化学镀样品的镀层沉积速率、形貌、P含量进行测试分析。结果表明,镀液温度为35 ℃,pH值为3～13时,随着pH值增大,沉积速率逐渐增大,P含量逐渐减小。但pH值高于11时,反应速率过快,不易稳定镀液pH值,且镀液易分解,因此pH值在5～11较为合适。在镀液pH值为5,温度为30～50 ℃时,随着温度升高,沉积速率和P含量都随之增高,镀层致密无漏镀。但温度高于45 ℃时,反应速率过快,不易稳定镀液pH值,因此温度在35～45 ℃较为合适。
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| 关 键 词： | 金刚石微粉 低温化学镀镍 络合剂 pH值 温度 |
| 收稿时间： | 2022-05-23 |
Influencing Factors of Electroless Nickel Plating of Diamond Micro-Powders at Low Temperature |
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| FANG Lili,LI Jinghua,LIU Han.Influencing Factors of Electroless Nickel Plating of Diamond Micro-Powders at Low Temperature[J].Journal of Synthetic Crystals,2022,51(8):1459-1465. |
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| Authors: | FANG Lili LI Jinghua LIU Han |
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| Affiliation: | Zhengzhou Key Laboratory of Low-Dimensional Quantum Materials and Devices, College of Science, Zhongyuan University of Technology, Zhengzhou 450007, China |
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| Abstract: | The influence of complexing agent, solution pH value and temperature on the quality of electroless nickel plating of diamond powder at low temperature were investigated. At the temperature of 35 ℃ and the pH value of 5, the stability of plating solution, deposition rate, morphology and phosphorus (P) content of electroless nickel plating coating were tested and analyzed by changing the ratio of complexing agent. The results show that C6H8O7·H2O (20 g/L)+(CH2)2(COOH)2(5 g/L) is the best complexing agent in test samples. The electroless plating solution corresponding to the complexing agent has good stability and rapid deposition rate (0.391 5 g/h), and the obtained coating is leak-free and dense, with P weight content of 11.73%. The deposition rate, morphology and P content of electroless plating samples were measured and analyzed by changing pH value and temperature of plating solution with the best complexing agent. The results show that when the temperature of the plating bath is 35 ℃ and the pH value is 3~13, the deposition rate increases and the P content gradually decrease with the increase of the pH value. When the pH value is higher than 11, the rapid reaction rate is difficult to stabilize the pH value of the plating solution, and the plating solution is easy to decompose, so the pH value is more suitable within 5～11. The effect of temperature on plating was studied in the range of 30~50 ℃ at solution pH value of 5. It is found that the deposition rate and P content increase with the increase of temperature, and the plating layer is dense and leak-free. When the temperature is higher than 45 ℃, the reaction rate is too fast and it is not easy to stabilize the pH value of the plating solution, so the temperature is more appropriate in the range from 35 ℃ to 45 ℃. |
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| Keywords: | diamond micro-powder low temperature electroless nickel plating complexing agent pH value temperature |
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