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电致失效力学
引用本文:杨卫.电致失效力学[J].力学进展,1996,26(3):338-352.
作者姓名:杨卫
作者单位:清华大学工程力学系破坏力学开放实验室
摘    要:电致失效力学研究单调或交变电场载荷下由应力引起的失效行为,它包含了电致断裂、电致疲劳、电致迁移与电致损伤等新研究课题.本文概述了电致失效力学的领域与课题,并深入讨论了电致应变诱导断裂疲劳的机理及电迁移损伤的力电耦合过程.研究结果表明,电致失效力学可提供铁电陶瓷致动器和集成电路的若干关键设计参数.对铁电陶瓷多层共烧致动器,该分析提供其层厚、外加电场强度和交变电场循环周数.对集成电路内导线,该分析提供其允许电流密度和临界线长. 

关 键 词:失效力学    电致断裂    电致疲劳    电致迁移    迁移损伤

MECHTRONIC FAILURE ANALYSIS
Yang Wei.MECHTRONIC FAILURE ANALYSIS[J].Advances in Mechanics,1996,26(3):338-352.
Authors:Yang Wei
Abstract:Mechtronic failure analysis investigates stress-induced failure behavior under monotonic or cyclic electric loads. New research topics of mechtronicfailure analysis include electric fracture, electric fatigue, electromigration, andmigration-induced damage. The present paper surveys the field and typical topicsof mechtronic failure analysis. In-depth discussions are given for two subjects:fracture and fatigue mechanisms by electrostriction, and the mechtronic processof void damage induced by electromigration. The results indicate that severalkey design parameters for ferro-electric ceramic actuators and for integratedcircuits can be guided by the mechtronic failure analysis. For the case of ferroelectric ceramic multi- layer co- fired actuators,the present analysis providesthe reliability guidelines for layer thickness,applied field strength and allowablecycles of current alternation. For the interconnects of integrated circuits, thepresent analysis provides the safe current density and the critical- line-length toprevent void damage under electromigration.
Keywords:mechtronics  failure analysis  electric fracture  electric  fatigue  eleclro-migralion  migration-induced damage    
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