| 热蒸镀法制备Z箍缩用铝镁合金箔材及其性能 |
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| 引用本文： | 刘旭东,杨毅,白黎,杨波,牛高,余斌,朱晔,周秀文.热蒸镀法制备Z箍缩用铝镁合金箔材及其性能[J].强激光与粒子束,2016,28(2):022002. |
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| 作者姓名： | 刘旭东 杨毅 白黎 杨波 牛高 余斌 朱晔 周秀文 |
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| 作者单位： | 1.中国工程物理研究院 激光聚变研究中心, 四川 绵阳 621 900 |
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| 摘 要： | 厚度低于5 m的AlMg合金箔材可作为带材切割的原材料应用于Z箍缩物理实验。利用热蒸镀方法，通过控制沉积速率在超光滑的NaCl基片上获得了AlMg薄膜，最终在脱膜后获得了厚度低于5 m的无支撑AlMg箔材。实验对该箔材的厚度均匀性、表面粗糙度、衍射峰位、晶粒尺寸及距表面不同距离下的成份进行了分析表征。实验发现，此热蒸镀法制备的AlMg合金箔材的厚度均匀性优于8%，两面的表面粗糙度均小于180 nm，晶粒尺寸约20 nm；不同厚度样品的衍射峰位未明显偏移，箔材内应力很小；不同深度下Mg含量稳定分布，而在箔材表面杂质含量较高，在距表面6 nm以下合金含量达到预期值并趋于稳定。热蒸镀法制得的无支撑AlMg合金箔材具有厚度可控且均匀、成分稳定、内应力小的特点，适用于制备Z箍缩带阵负载。
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| 关 键 词： | 铝镁合金 热蒸镀 粗糙度 带阵 Z箍缩 |
| 收稿时间： | 2015-10-23 |
Preparation and properties of AlMg alloy film by thermal evaporation for Z-pinch |
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| Affiliation: | 1.Research Center of Laser Fusion,CAEP,P.O.Box 919-987,Mianyang 621900,China |
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| Abstract: | AlMg alloy films with a thickness less than 5 m could be used as raw materials of precision cutting for ribbon array load in Z-pinch physics tests. In this paper, the thermal evaporation was used to prepare such ultrathin AlMg alloy films. By controlling the deposition rate of the thermal evaporation craft, AlMg alloy films with a thickness less than 5 m were coated on super-smooth NaCl substrate and after subsequent process of NaCl substrate solution, unbraced AlMg alloy films were achieved. Thickness uniformity, surface roughness, diffraction peak site, crystal grain size and elements component with different distances to surface were measured. It was found that in such a thermal evaporation way, the thickness uniformity of AlMg alloy films was better than 8%, the surface roughness (Ra) of both sides of samples less than 180 nm, the crystal grain size less than 20 nm. It was showed that diffraction peak site of samples with different thickness hardly displaced in the common meaning of few internal stress. It was also showed that the content of Mg element under different depths was stable, the impurity content of film surface was higher than that in the center place, and an anticipative component could be achieved under 6 nm depth stably. Prepared by thermal evaporation, unbraced AlMg alloy films with the characteristics of controllable and uniform thickness, stable component and few internal stress were applicable for ribbon array load of Z-pinch. |
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