Degradation of the transconductance of gate-modulated generation current in nMOSFET |
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| Authors: | Chen Hai-Feng Guo Li-Xin Du Hui-Min |
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| Affiliation: | School of Electronic Engineering, Xi'an University of Posts and Telecommunications, Xi'an 710121, China |
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| Abstract: | The degradation of transconductance (G) of gate-modulated generation current IGD in LDD nMOSFET is investigated. The G curve shifts rightward under the single electron-injection-stress (EIS). The trapped electrons located in the gate oxide over the LDD region (QL) makes the effective drain voltage minish. Accordingly, the G peak in depletion (GMD) and that in weak inversion (GMW) decrease. It is found that Δ GMD and Δ GMW each have a linear relationship with the n-th power of stress time (tn) in dual-log coordinate: Δ GMD ∝ tn, Δ GMD ∝ tn (n=0.25). During the alternate stress, the injected holes neutralize QL induced by the previous EIS. This neutralization makes the effective VD restore to the initial value and then the IGD peak recovers completely. Yet the threshold voltage recovery is incomplete due to the trapped electron located over the channel (QC). As a result, GMW only recovers to the circa 50% of the initial value after the hole-injection-stress (HIS). Instead, GMD is almost recovered. The relevant mechanisms are given in detail. |
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| Keywords: | generation current transconductance electron injection alternate stress degradation |
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