Residual stress induced wetting variation on electric brush-plated Cu film |
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作者姓名: | 孟可可 江月 江忠浩 连建设 蒋青 |
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基金项目: | Project supported by the National Natural Science Foundations of China(Grant No.51371089);the Foundation of National Key Basic Research and Development Program of China(Grant No.2010CB 631001) |
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摘 要: | Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as- prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure.
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关 键 词: | 电刷镀技术 残余应力 Cu膜 润湿性 表面纳米结构 水接触角 纳米压痕 超亲水 |
Residual stress induced wetting variation on electric brush-plated Cu film |
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Abstract: | Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The asprepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10o. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90o to apparent hydrophobicity with water contact angle larger than 90o are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure. |
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Keywords: | superhydrophilicity wetting transition residual stress nano indenter |
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