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Effect of F doping on capacitance-voltage characteristics of SiCOH low-k films metal-insulator-semiconductor structure
引用本文:叶超,宁兆元.Effect of F doping on capacitance-voltage characteristics of SiCOH low-k films metal-insulator-semiconductor structure[J].中国物理 B,2010,19(5):57701-057701.
作者姓名:叶超  宁兆元
作者单位:School of Physics Science and Technology, Jiangsu Key Laboratory of Thin Films, Soochow University, Suzhou 215006, China;School of Physics Science and Technology, Jiangsu Key Laboratory of Thin Films, Soochow University, Suzhou 215006, China
基金项目:Project supported by the National Natural Science Foundation of China (Grant No.~10575074).
摘    要:This paper investigates the capacitance-voltage (C-V) characteristics of F doping SiCOH low dielectric constant films metal-insulator-semiconductor structure. The F doping SiCOH films are deposited by decamethylcyclopentasilox-ane DMCPS) and trifluromethane (CHF3) electron cyclotron resonance plasmas. With the CHF3/DMCPS flow rate ratio from 0 to 0.52, the positive excursion of C-V curves and the increase of fiat-band voltage VFB from -6.1 V to 32.2V are obtained. The excursion of C-V curves and the shift of VFB are related to the change of defects density and type at the Si/SiCOH interface due to the decrease of Si and O concentrations, and the increase of F concentration. At the CHF3/DMCPS flow rate ratio is 0.12, the compensation of F-bonding dangling bond to Si dangling bond leads to a small VFB of 2.0V.

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收稿时间:2/4/2009 12:00:00 AM

Effect of F doping on capacitance-voltage characteristics of SiCOH low-k films metal-insulator-semiconductor structure
Ye Chao and Ning Zhao-Yuan.Effect of F doping on capacitance-voltage characteristics of SiCOH low-k films metal-insulator-semiconductor structure[J].Chinese Physics B,2010,19(5):57701-057701.
Authors:Ye Chao and Ning Zhao-Yuan
Affiliation:School of Physics Science and Technology, Jiangsu Key Laboratory of Thin Films, Soochow University, Suzhou 215006, China
Abstract:This paper investigates the capacitance--voltage ($C$--$V$) characteristics of F doping SiCOH low dielectric constant films metal--insulator--semiconductor structure. The F doping SiCOH films are deposited by decamethylcyclopentasiloxane (DMCPS) and trifluromethane (CHF$_{3})$ electron cyclotron resonance plasmas. With the CHF$_{3}$/DMCPS flow rate ratio from 0 to 0.52, the positive excursion of $C$--$V$ curves and the increase of flat-band voltage $V_{\rm FB}$ from $-6.1$~V to 32.2~V are obtained. The excursion of $C$--$V$ curves and the shift of $V_{\rm FB}$ are related to the change of defects density and type at the Si/SiCOH interface due to the decrease of Si and O concentrations, and the increase of F concentration. At the CHF$_{3}$/DMCPS flow rate ratio is 0.12, the compensation of F-bonding dangling bond to Si dangling bond leads to a small $V_{\rm FB}$ of 2.0~V.
Keywords:F-SiCOH  low-k dielectrics  capacitance--voltage characteristic
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