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Local thermal conductivity of polycrystalline AlN ceramics measured by scanning thermal microscopy and complementary scanning electron microscopy techniques |
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| Authors: | Zhang Yue-Fei Wang Li R Heiderhoff A K Geinzer Wei Bin Ji Yuan Han Xiao-Dong L J Balk and Zhang Ze |
| Affiliation: | Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;Department of Electronics, Faculty of Electrical, Information and Media Engineering, University of Wuppertal, Wuppertal D-42119, Germany;Department of Electronics, Faculty of Electrical, Information and Media Engineering, University of Wuppertal, Wuppertal D-42119, Germany;Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;Department of Electronics, Faculty of Electrical, Information and Media Engineering, University of Wuppertal, Wuppertal D-42119, Germany;Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China; Department of Materials Science, Zhejiang University, Hangzhou 300038, China |
| Abstract: | The local thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics is measured and imaged by using a scanning thermal microscope (SThM) and complementary scanning electron microscope (SEM) based techniques at room temperature. The quantitative thermal conductivity for the AlN sample is gained by using a SThM with a spatial resolution of sub-micrometer scale through using the 3ω method. A thermal conductivity of 308 W/m·K within grains corresponding to that of high-purity single crystal AlN is obtained. The slight differences in thermal conduction between the adjacent grains are found to result from crystallographic misorientations, as demonstrated in the electron backscattered diffraction. A much lower thermal conductivity at the grain boundary is due to impurities and defects enriched in these sites, as indicated by energy dispersive X-ray spectroscopy. |
| Keywords: | thermal conductivity AlN ceramics scanning thermal microscopy scanning electron microscopy |
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